Temporary fixing agent for organic substrate and method for manufacturing semiconductor device using the same

有機基板の仮固定剤及びそれを用いた半導体装置の製造方法

Abstract

【課題】 有機基板へのダメージを低減させ、容易に脱離可能で、かつ熱分解に要する時間を短縮できる、有機基板の仮固定剤及びそれを用いた半導体装置の製造方法を提供する。 【解決の手段】 有機基板を加工するために有機基板を支持基材に仮固定し、加工後に加熱することにより有機基板を支持基材から脱離するために使用される仮固定剤において、95%重量減少温度と5%重量減少温度との差が、5℃≦(95%重量減少温度)−(5%重量減少温度)≦100℃である樹脂成分を含む有機基板の仮固定剤が提供される。 【選択図】図5
PROBLEM TO BE SOLVED: To provide a temporary fixing agent for an organic substrate which reduces the damage to an organic base material, is easily removable, and can shorten the time required for thermal decomposition and a method for manufacturing a semiconductor device using the same. SOLUTION: The temporary fixing agent to be used for temporarily fixing an organic substrate to a supporting base material and heating the resultant after processing to remove the organic substrate from the supporting base material includes a resin component having a difference between 95% weight reduction temperature and 5% weight reduction temperature of 5°C≤(95% weight reduction temperature)-(5% weight reduction temperature)≤100°C. COPYRIGHT: (C)2011,JPO&INPIT

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